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RF and Microwave Microelectronics Packaging II
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 79.30
£ 11.98 shipping
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Paperback. Condition: New.
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Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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RF and Microwave Microelectronics Packaging II
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 114.30
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
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RF and Microwave Microelectronics Packaging II (Paperback)
Language: English
Published by Springer International Publishing AG, Cham, 2018
ISBN 10: 3319847198 ISBN 13: 9783319847191
Paperback. Condition: new. Paperback. This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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RF and Microwave Microelectronics Packaging II (Hardcover)
Language: English
Published by Springer International Publishing AG, Cham, 2017
ISBN 10: 3319516965 ISBN 13: 9783319516967
First Edition
Hardcover. Condition: new. Hardcover. This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Condition: New.
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Condition: New.
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Condition: New.
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RF and Microwave Microelectronics Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 134.30
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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RF and Microwave Microelectronics Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 134.30
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Condition: New. pp. 184.
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Rf and Microwave Microelectronics Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 133.71
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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RF and Microwave Microelectronics Packaging (Paperback)
Language: English
Published by Springer-Verlag New York Inc., New York, 2014
ISBN 10: 1489983244 ISBN 13: 9781489983244
Paperback. Condition: new. Paperback. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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RF and Microwave Microelectronics Packaging (Hardcover)
Language: English
Published by Springer-Verlag New York Inc., New York, NY, 2009
ISBN 10: 1441909834 ISBN 13: 9781441909831
Hardcover. Condition: new. Hardcover. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
ISBN 10: 3319847198 ISBN 13: 9783319847191
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ¿RF and Microwave Microelectronics Packaging¿ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017
ISBN 10: 3319516965 ISBN 13: 9783319516967
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ¿RF and Microwave Microelectronics Packaging¿ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, Springer Nature Switzerland, 2018
ISBN 10: 3319847198 ISBN 13: 9783319847191
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
-
RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, Springer Nature Switzerland, 2017
ISBN 10: 3319516965 ISBN 13: 9783319516967
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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Condition: New. pp. 304.
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Hardcover. Condition: Brand New. 172 pages. 9.25x6.25x0.50 inches. In Stock.
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Paperback. Condition: New. New. book.
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Condition: Sehr gut. Zustand: Sehr gut | Seiten: 285 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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RF and Microwave Microelectronics Packaging
Language: English
Published by Springer New York, Springer US, 2014
ISBN 10: 1489983244 ISBN 13: 9781489983244
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Rf and Microwave Microelectronics Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 198.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
