Microelectronic Packaging Fundamentals Applications (8 results)
Language: English
Published by Springer, 2017
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
- First Edition
Seller: Homeless Books, Berlin, GermanyHomeless Books
Contact seller5-star sellerCondition: Used - Fine
£ 58.17
£ 17.07 shippingShips from Germany to U.S.A.Quantity: 1 available
Hardcover. Condition: Sehr gut. 1. Auflage. Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, a…n industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 168.56
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
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Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
£ 135.82
£ 59.90 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. 3D Microelectronic Packaging | From Fundamentals to Applications | Yan Li (u. a.) | Taschenbuch | ix | Englisch | 2018 | Springer | EAN 9783319830865 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: pr…eigu.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 202.03
£ 2.96 shippingShips within U.S.A.Quantity: 4 available
Condition: New. Softcover reprint of the original 1st ed. 2017 edition NO-PA16APR2015-KAP.
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Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 171.79
£ 54.41 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectr…onic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: New
£ 253.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 212.00
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 221.74
£ 8.51 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND.
