International Conference Electronics Engineering (299 results)
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- Softcover
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Language: English
Published by Springer 2020-08, 2020
Series: Book 217 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Language: English
Published by Springer, 2020
Series: Book 217 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Condition: New. pp. 281 1st ed. 2019 edition NO-PA16APR2015-KAP.
Language: English
Published by Springer, 2019
Series: Book 217 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Advances in Power Electronics and Instrumentation Engineering: Second International Conference, Peie 2011, Nagpur, Maharashtra, India, April 21-22, 2011. Proceedings
Das, Vinu V. (Editor)/ Thankachan, Nessy (Editor)/ Debnath, Narayan C. (Editor)
- Softcover
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Paperback. Condition: Brand New. 146 pages. 9.00x5.75x0.25 inches. In Stock.
Language: English
Published by Springer-Verlag New York Inc, 2011
Series: Book 30 of 578 - Communications in Computer and Information Science
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. 2010 edition. 112 pages. 9.50x6.25x0.25 inches. In Stock.
Language: English
Published by Springer-Nature New York Inc, 2020
Series: Book 217 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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- Softcover
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- Softcover
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- Softcover
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- Hardcover
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MANAGEMENT INFORMATION AND OPTOELECTRONIC ENGINEERING: PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON MANAGEMENT, INFORMATION AND COMMUNICATION & . ON OPTICS AND ELECTRONICS ENGINEERING
Yongsheng Gao (Editor), Sha Wu (Editor), Xuewu Han (Editor),
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- Hardcover
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- Hardcover
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- Softcover
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Language: English
Published by Springer International Publishing, 2019
Series: Book 217 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this… volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
Language: English
Published by Springer, 2020
Series: Book 217 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Taschenbuch. Condition: Neu. VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms | 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8-10, 2018, Revised and Extended Selected Papers | Nicola Bombieri (u. a.) | Taschenbuch |…xiv | Englisch | 2020 | Springer | EAN 9783030234270 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer, Berlin, Springer, 2020
Series: Book 217 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included…in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
- Hardcover
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- Hardcover
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- Hardcover
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- Hardcover
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- Softcover
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- Hardcover
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- Hardcover
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- Hardcover
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- Hardcover
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