Interconnect Reliability Advanced Memory by Gan Chong (20 results)

Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
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Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
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Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
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Language: English
Published by Springer International Publishing AG, Cham, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
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Hardcover. Condition: new. Hardcover. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interco…nnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
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Language: English
Published by Springer, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
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Taschenbuch. Condition: Neu. Interconnect Reliability in Advanced Memory Device Packaging | Chong Leong Gan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | xviii | Englisch | 2024 | Springer | EAN 9783031267109 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, ju…ergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Language: English
Published by Springer, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
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Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
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Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and techni…cal challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Language: English
Published by Springer-Nature New York Inc, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
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Published by Springer Nature B.V., 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
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Published by Springer Nature B.V., 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
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Language: English
Published by Springer, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
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Language: English
Published by Springer, 2023
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- Hardcover
- Print on Demand
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Published by Springer, Berlin|Springer International Publishing|Springer, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This boo…k discusses the rel.

Language: English
Published by Springer, Berlin|Springer International Publishing|Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
- Print on Demand
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This boo…k discusses the rel.

Language: English
Published by Springer, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
- Print on Demand
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Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
- Print on Demand
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Published by Springer, 2024
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- Softcover
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Language: English
Published by Springer, 2023
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- Hardcover
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