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Condition: New. pp. 290 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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£ 63.49
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£ 85.53
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Add to basketCondition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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£ 81.11
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Add to basketCondition: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems Series)
Seller: Pistil Books Online, IOBA, Seattle, WA, U.S.A.
Association Member: IOBA
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£ 83.49
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Add to basketHard Cover. Condition: Fine. No Jacket. A clean, unmarked book with a tight binding. 278 pages.
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3D Integration for NoC-based SoC Architectures
Published by Springer US, Springer New York, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Language: English
£ 108.08
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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3D Integration for NoC-based SoC Architectures
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
£ 125.26
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£ 114.16
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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3D Integration for NoC-based SoC Architectures (Paperback)
Published by Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Language: English
£ 99.91
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Add to basketPaperback. Condition: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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£ 96.88
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£ 149.40
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Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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£ 160.05
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£ 136.41
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3D Integration for NoC-based SoC Architectures (Hardcover)
Published by Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Language: English
£ 156.64
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Add to basketHardcover. Condition: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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3D Integration for NoC-based SoC Architectures (Paperback)
Published by Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Language: English
£ 178.32
Convert currency£ 27.45 shipping from Australia to United KingdomQuantity: 1 available
Add to basketPaperback. Condition: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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3D Integration for NoC-based SoC Architectures
Published by Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Language: English
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
£ 203.27
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Add to basketCondition: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . .
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3D Integration for NoC-based SoC Architectures
Published by Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Language: English
£ 246.35
Convert currency£ 2.23 shipping from U.S.A. to United KingdomQuantity: 15 available
Add to basketCondition: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . . Books ship from the US and Ireland.
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3D Integration for NoC-based SoC Architectures (Hardcover)
Published by Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Language: English
£ 262.20
Convert currency£ 27.45 shipping from Australia to United KingdomQuantity: 1 available
Add to basketHardcover. Condition: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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£ 91.32
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Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.
