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Published by Springer, Berlin|Springer International Publishing|Morgan & Claypool|Springer, 2015
ISBN 10: 3031006194 ISBN 13: 9783031006197
Language: English
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Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory b.