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Development Packaging Microsystems Using by Butler Jeffrey (15 results)
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Condition: New.
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Development and Packaging of Microsystems Using Foundry Services (Paperback or Softback)
Language: English
Published by Biblioscholar 10/26/2012, 2012
ISBN 10: 1286866936 ISBN 13: 9781286866931
Paperback or Softback. Condition: New. Development and Packaging of Microsystems Using Foundry Services. Book.
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Development and Packaging of Microsystems Using Foundry Services
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 21.57
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Development and Packaging of Microsystems Using Foundry Services
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Condition: New. KlappentextrnrnMicro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. Several advances to the MEMS and microsystem state of the art were achieved through the design and characterization of novel MEMS d.
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Development and Packaging of Microsystems Using Foundry Services
Language: English
Published by Creative Media Partners, LLC Okt 2012, 2012
ISBN 10: 1286866936 ISBN 13: 9781286866931
Taschenbuch. Condition: Neu. Neuware - Micro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. Several advances to the MEMS and microsystem state of the art were achieved through the design and characterization of novel MEMS devices and packaging, which are compatible with CMOS microelectronics. Empirical and theoretical models of polysilicon thermal actuators were developed to understand and simulate the behavior of thermal actuators. These models can be implemented in microelectronic circuit simulators such as SPICE and allow the simultaneous simulation of thermally actuated MEMS and microelectronics. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10-3 K-1. In addition, the sheet resistance of all the MUMPs polysilicon layers was found to be dependent on the linewidth due to the presence or absence of lateral phosphorus diffusion.
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Development and Packaging of Microsystems Using Foundry Services
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 106.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Paperback. Condition: Like New. Like New. book.
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Condition: As New. Unread book in perfect condition.
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Development and Packaging of Microsystems Using Foundry Services
Language: English
Published by Creative Media Partners, LLC, 2012
ISBN 10: 1286866936 ISBN 13: 9781286866931
PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Development and Packaging of Microsystems Using Foundry Services
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
£ 21.18
£ 5.02 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Condition: New. Print on Demand pp. 328.
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Condition: New. Print on Demand pp. 328.
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Condition: New. PRINT ON DEMAND pp. 328.
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Development and Packaging of Microsystems Using Foundry Services
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
£ 23.90
£ 16.90 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
