Advanced Electronic Packaging Technology by Jing Ning (1 results)

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  • Language: English

    Published by Chemical Industry Press, 2024

    7122458822 / 9787122458827

    • Softcover

    Seller: liu xing, Nanjing, JS, Chinaliu xing

    5-star seller
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    Condition: New

    £ 131.11

    £ 13.52 shipping 
    Ships from China to U.S.A.

    Quantity: 1 available

    paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi.…