3d Vsp Multiwave Data Processing by Liu Ming (1 results)

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    • Language: English

      Published by Northeastern University Press, 2025

      7551735585 / 9787551735582

      • Softcover

      Seller: liu xing, Nanjing, JS, Chinaliu xing

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      Condition: New

      £ 80.01

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      paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2025-01 Pages: 164 Publisher: Northeastern University Press Three-dimensional vertical seismic profiling (3D-VSP) multi-wave data processing is a systematic engineering project. This book details 3D-VSP exploration technology and studies its application in conjunction with rock and rock property parameter variations. It combines seismic profile and well logging data for wavelet extraction. seismic record synthesis. profile compression. stratigraphic compa.