springer us chapman and hall crc jan 2003 (2 results)

Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the number of processor cores and IP blocks integrated on a single chip is steadily growing, a systematic approach to design the communication infrastructure becomes necessary. Different variants of packed switched on-chip networks have been proposed by several groups during the past two years. This book summarizes the state of the art of these efforts and discusses the major issues from the physical integration to architecture to operating systems and application interfaces. It also provides a guideline and vision about the direction this field is moving to. Moreover, the book outlines the consequences of adopting design platforms based on packet switched network. The consequences may in fact be far reaching because many of the topics of distributed systems, distributed real-time systems, fault tolerant systems, parallel computer architecture, parallel programming as well as traditional system-on-chip issues will appear relevant but within the constraints of a single chip VLSI implementation. 316 pp. Englisch.

Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -After an introductory chapter, the processing, microstructure, and properties of various ceramic materials, reinforcements, and their composites are described. A separate chapter is devoted to processing of ceramic reinforcements, with a special emphasis on fibers. Processing of ceramic matrix composites is the next chapter, which includes novel techniques such as sol-gel processing and ceramics from polymeric precursors. The next four chapters cover the subjects of interface region in ceramic composites, mechanical and physical properties, and the role of thermal stresses and the important subject of toughness enhancement. Laminated composites made of ceramics are described in a separate chapter. Finally, a chapter is devoted to various applications of ceramic matrix composites. Throughout the text, the underlying relationships between the components of the triad: processing, microstructure, and properties are brought out. An exhaustive list of references and suggested reading is provided. 464 pp. Englisch.