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Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. xiii + 95.
Seller: Revaluation Books, Exeter, United Kingdom
Hardcover. Condition: Brand New. 2014 edition. 142 pages. 9.25x6.25x0.25 inches. In Stock.
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
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Seller: Mispah books, Redhill, SURRE, United Kingdom
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Seller: GreatBookPrices, Columbia, MD, U.S.A.
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Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer New York Okt 2013, 2013
ISBN 10: 146148880X ISBN 13: 9781461488804
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory. 112 pp. Englisch.
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive overview of embedded memory design and associated challenges and choicesExplains tradeoffs and dependencies across different disciplines involved with multi-core and system on chip memory designIncludes detailed dis.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. xiii + 95 63 Illus. (37 Col.).
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. xiii + 95.
Seller: preigu, Osnabrück, Germany
Buch. Condition: Neu. Embedded Memory Design for Multi-Core and Systems on Chip | Baker Mohammad | Buch | xiii | Englisch | 2013 | Humana | EAN 9781461488804 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Language: English
Published by Springer, Humana Okt 2013, 2013
ISBN 10: 146148880X ISBN 13: 9781461488804
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 112 pp. Englisch.