ISBN: 9780780347007 - Advanced Electronic Packaging: With Emphasis on Multichip Modules (ieee Press Series on Microelectronic Systems) (6 results)

hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condition: Acceptable. SHIPS FAST. RESCUED + REPAIRED. Features a small coffee mishap, plus a reinforced binding, secured cover, and light annotations or highlighting-a durable, fully readable working copy brought back to life at a great value by our Book Sustainability Project. No access codes or CDs.…

Condition: Very Good. 1st Edition. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hardcover. Condition: Very Good. Book is in very nice condition, text is unmarked and pages are tight.

Condition: Very Good. Heavy book, requires extra postage. A very good plus copy, no dustjacket. 8vo. xxxii, 789 pp. Hardcover, glossy pictorial boards.