Paperback. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
Paperback. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Seller: suffolkbooks, Center moriches, NY, U.S.A.
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Language: English
Published by Cham, Springer International Publishing., 2015
ISBN 10: 3319128612 ISBN 13: 9783319128610
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
235 mm x 155 mm. X, 194 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.
paperback. Condition: New. In shrink wrap. Looks like an interesting title!
Seller: GreatBookPrices, Columbia, MD, U.S.A.
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Seller: Buchpark, Trebbin, Germany
Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.
Seller: GreatBookPrices, Columbia, MD, U.S.A.
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: Chiron Media, Wallingford, United Kingdom
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Seller: GreatBookPrices, Columbia, MD, U.S.A.
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Seller: GreatBookPrices, Columbia, MD, U.S.A.
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Language: English
Published by Emerald Publishing Limited, GB, 2024
ISBN 10: 1835498353 ISBN 13: 9781835498354
Seller: Rarewaves USA, OSWEGO, IL, U.S.A.
Hardback. Condition: New. Seismic Retrofit of Existing Buildings is a concise and easy-to-use book aimed at supporting engineers in the design of retrofit solutions for seismically vulnerable buildings. It offers readers guidance on both conceptual design strategies and relevant detailed design considerations, drawing from the authors' extensive experience in research and practice in seismic regions. Useful advice is provided on the design choices and detailing tips recognising the practical implementation challenges behind these projects. It brings together the need-to-know information in one guide and will help you cut through conflicting advice, demystify technical jargon and interpret international standards to ensure that you have the right tools and knowledge in order to retrofit any building structure anywhere in the world.This book is unique in its coverage of a range of global and local seismic retrofit solutions applicable to buildings constructed in unreinforced masonry, reinforced concrete, structural steel and timber.Highlights include:background on seismic risk mitigation and the basis for retrofitpractical design tips and advice on consulting with clientsan overview of seismic assessment of existing structures, with reference to international standards including Eurocode 8, ASCE-41 and New Zealand standardsguidance on commonly used seismic retrofit solutions with supporting conceptual design examplescoverage of various construction types vulnerable to earthquakes and the specific retrofit techniques employed to improve their performancecommentary on future trends and the relevance of seismic retrofit of existing buildings to sustainability goals. It will be an indispensable companion for engineers, construction professionals and researchers, who seek to understand the principles behind seismic retrofit and the challenges and solutions in practical implementation.
Seller: Majestic Books, Hounslow, United Kingdom
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Seller: Books Puddle, New York, NY, U.S.A.
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Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 272.
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
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Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 272.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: Books Puddle, New York, NY, U.S.A.
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Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 194.
Seller: Revaluation Books, Exeter, United Kingdom
Hardcover. Condition: Brand New. 2015 edition. 194 pages. 9.50x6.50x0.75 inches. In Stock.
Seller: Revaluation Books, Exeter, United Kingdom
Hardcover. Condition: Brand New. 267 pages. 9.25x6.25x0.50 inches. In Stock.
Seller: preigu, Osnabrück, Germany
Taschenbuch. Condition: Neu. Molecular Modeling and Multiscaling Issues for Electronic Material Applications | Volume 2 | Artur Wymyslowski (u. a.) | Taschenbuch | x | Englisch | 2016 | Springer | EAN 9783319366661 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Seller: Buchpark, Trebbin, Germany
Condition: Sehr gut. Zustand: Sehr gut | Seiten: 272 | Sprache: Englisch | Produktart: Bücher | Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue. Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes. Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials. Finally, Part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level.