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Published by Springer, 2003
ISBN 10: 1402075944ISBN 13: 9781402075940
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
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Published by Secaucus, New Jersey, U.S.A.: Springer Verlag, 2005
ISBN 10: 0387261036ISBN 13: 9780387261034
Seller: Sizzler Texts, South Pasadena, CA, U.S.A.
Soft cover. Condition: New. Dust Jacket Condition: New. 1st Edition. **International edition** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments contain tracking numbers. Great professional textbook selling experience and expedite shipping service.
Published by Cham, Springer., 2019
ISBN 10: 3319923293ISBN 13: 9783319923291
Book
XIII, 191 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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235 mm x 155 mm, 0 g. X, 279 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.
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Published by Cham, Springer., 2018
ISBN 10: 3319750577ISBN 13: 9783319750576
Book
xvi, 156 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Published by Cham, Springer., 2017
ISBN 10: 3319423029ISBN 13: 9783319423029
Book
IX, 383 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Published by Springer, 2010
ISBN 10: 1441938648ISBN 13: 9781441938640
Seller: Sizzler Texts, South Pasadena, CA, U.S.A.
Soft cover. Condition: New. Dust Jacket Condition: New. 1st Edition. **International edition** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments contain tracking numbers. Great professional textbook selling experience and expedite shipping service.
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Published by Springer, 2018
ISBN 10: 3319788892ISBN 13: 9783319788890
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Soft Cover. Condition: new.
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Published by Springer International Publishing AG, Cham, 2023
ISBN 10: 3031429206ISBN 13: 9783031429200
Seller: Grand Eagle Retail, Wilmington, DE, U.S.A.
Book First Edition
Paperback. Condition: new. Paperback. This book constitutes the proceedings of the 19th International Symposium on Applied Reconfigurable Computing, ARC 2023, which was held in Cottbus, Germany, in September 2023.The 18 full papers presented in this volume were reviewed and selected from numerous submissions. The proceedings also contain 4 short PhD papers. The contributions were organized in topical sections as follows: Design methods and tools; applications; architectures; special session: near and in-memory computing; and PhD forum papers. This book constitutes the proceedings of the 19th International Symposium on Applied Reconfigurable Computing, ARC 2023, which was held in Cottbus, Germany, in September 2023.The 18 full papers presented in this volume were reviewed and selected from numerous submissions. The proceedings also contain 4 short PhD papers. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Published by Springer, 2010
ISBN 10: 1441953930ISBN 13: 9781441953933
Seller: booksXpress, Bayonne, NJ, U.S.A.
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Soft Cover. Condition: new. This item is printed on demand.
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Published by Springer, 2018
ISBN 10: 3030064085ISBN 13: 9783030064082
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Soft Cover. Condition: new.
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Published by Springer International Publishing Jan 2019, 2019
ISBN 10: 3030091384ISBN 13: 9783030091385
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The history of flight started with the pioneer era. The introduction of mechanical controls (including hydraulics) then led to the second era. Later, with the utilization of computers and automation in aircraft, we reached the third era. Now, we are moving towards the fourth era of flight, namely Flight 4.0, which is characterized by 'smart' and 'connected' aircraft that extensively exploit emerging information and communication technologies.Aeronautical informatics is advancing rapidly through the synergy between information and communication technologies and aeronautics. Multi-core avionic platforms, wireless avionics networking, service-oriented architectures and IoT, data sciences and semantic infrastructures are shaping systems to come. Increasing autonomy requirements are challenging the community to investigate new ways to assure safety. Modern software engineering methodologies and real-time software techniques are altering the established development practice. Universities are starting to align their aerospace engineering and computer science curriculums in order to address this synergy.This book is a unique compilation of advancements in aeronautical informatics, introducing the changing technology landscape of flight with respect to a new push in information and communication technology. 172 pp. Englisch.
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Published by Springer Nature Switzerland Feb 2024, 2024
ISBN 10: 3031545303ISBN 13: 9783031545306
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The three-volume set LNICST 561, 562 563 constitutes the refereed post-conferenceproceedings of the 19th EAI International ConferenceonCollaborative Computing: Networking, Applications and Worksharing, CollaborateCom 2023, held in Corfu Island, Greece, duringOctober 4-6, 2023.The72full papers presented in these proceedings were carefully reviewed andselected from176submissions. The papers are organized in the following topicalsections:Volume I :Collaborative Computing,Edge Computing & Collaborative working,Blockchain applications,Code Search and Completion,Edge Computing Scheduling and Offloading.Volume II:Deep Learning and Application,Graph Computing,Security and Privacy Protection andProcessing and Recognition.Volume III:Onsite Session Day 2,Federated learning and application,Collaborative working,Edge ComputingandPrediction, Optimization and Applications. 424 pp. Englisch.
Published by Springer Nature Switzerland Mrz 2024, 2024
ISBN 10: 3031545206ISBN 13: 9783031545207
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The three-volume set LNICST 561, 562 563 constitutes the refereed post-conferenceproceedings of the 19th EAI International ConferenceonCollaborative Computing: Networking, Applications and Worksharing, CollaborateCom 2023, held in Corfu Island, Greece, duringOctober 4-6, 2023.The72full papers presented in these proceedings were carefully reviewed andselected from176submissions. The papers are organized in the following topicalsections:Volume I :Collaborative Computing,Edge Computing & Collaborative working,Blockchain applications,Code Search and Completion,Edge Computing Scheduling and Offloading.Volume II:Deep Learning and Application,Graph Computing,Security and Privacy Protection andProcessing and Recognition.Volume III:Onsite Session Day 2,Federated learning and application,Collaborative working,Edge ComputingandPrediction, Optimization and Applications. 468 pp. Englisch.
Published by Springer Nature Switzerland Feb 2024, 2024
ISBN 10: 3031545273ISBN 13: 9783031545276
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Book Print on Demand
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The three-volume set LNICST 561, 562 563 constitutes the refereed post-conferenceproceedings of the 19th EAI International ConferenceonCollaborative Computing: Networking, Applications and Worksharing, CollaborateCom 2023, held in Corfu Island, Greece, duringOctober 4-6, 2023.The72full papers presented in these proceedings were carefully reviewed andselected from176submissions. The papers are organized in the following topicalsections:Volume I :Collaborative Computing,Edge Computing & Collaborative working,Blockchain applications,Code Search and Completion,Edge Computing Scheduling and Offloading.Volume II:Deep Learning and Application,Graph Computing,Security and Privacy Protection andProcessing and Recognition.Volume III:Onsite Session Day 2,Federated learning and application,Collaborative working,Edge ComputingandPrediction, Optimization and Applications. 552 pp. Englisch.
Published by Springer International Publishing Okt 2016, 2016
ISBN 10: 3319361791ISBN 13: 9783319361796
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces a new cyberphysical system that combines clinical and basic neuroscience research with advanced data analysis and medical management tools for developing novel applications for the management of epilepsy. The authors describe the algorithms and architectures needed to provide ambulatory, diagnostic and long-term monitoring services, through multi parametric data collection. Readers will see how to achieve in-hospital quality standards, addressing conventional 'routine' clinic-based service purposes, at reduced cost, enhanced capability and increased geographical availability. The cyberphysical system described in this book is flexible, can be optimized for each patient and is demonstrated in several case studies. 292 pp. Englisch.
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Published by Springer, 2018
ISBN 10: 3319825496ISBN 13: 9783319825496
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Soft Cover. Condition: new.
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Published by Springer, 2010
ISBN 10: 9048185009ISBN 13: 9789048185009
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
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Published by Springer, 2009
ISBN 10: 9048124263ISBN 13: 9789048124268
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Hardcover. Condition: new.
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Published by Springer, 2011
ISBN 10: 9400714874ISBN 13: 9789400714878
Seller: booksXpress, Bayonne, NJ, U.S.A.
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Hardcover. Condition: new. This item is printed on demand.
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Published by Springer Netherlands Nov 2013, 2013
ISBN 10: 9400737629ISBN 13: 9789400737624
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -VLSI 2010 Annual Symposium will present extended versions of the best papers presented in ISVLSI 2010 conference. The areas covered by the papers will include among others: Emerging Trends in VLSI, Nanoelectronics, Molecular, Biological and Quantum Computing. MEMS, VLSI Circuits and Systems, Field-programmable and Reconfigurable Systems, System Level Design, System-on-a-Chip Design, Application-Specific Low Power, VLSI System Design, System Issues in Complexity, Low Power, Heat Dissipation, Power Awareness in VLSI Design, Test and Verification, Mixed-Signal Design and Analysis, Electrical/Packaging Co-Design, Physical Design, Intellectual property creating and sharing. 356 pp. Englisch.
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