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Sheng Wen Feng Deng Zhu (4 results)
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ARM Embedded Linux Systems development from entry to the master(Chinese Edition)
Published by Tsinghua University Press, 2000
ISBN 10: 7302156875 ISBN 13: 9787302156871
Language: English
£ 51.02
Convert currency£ 11.16 shipping from China to United KingdomQuantity: 1 available
Add to basketpaperback. Condition: New. Language:Chinese.Paperback. Publisher: Tsinghua University.
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New Curriculum heavy and difficult manual high school chemistry (compulsory) (title page names. with handwriting)(Chinese Edition)(Old-Used)
ISBN 10: 7562230544 ISBN 13: 9787562230540
£ 30.35
Convert currency£ 11.16 shipping from China to United KingdomQuantity: 1 available
Add to basketpaperback. Condition: Good. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2006-08 Pages: 432 Publisher: Central China Normal University Press sheet: 13.75 title page names. with handwritingFour Satisfaction guaranteed,or money back.
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£ 45.09
Convert currency£ 11.16 shipping from China to United KingdomQuantity: 1 available
Add to basketpaperback. Condition: New. Pub Date :2006-12-01 Pages: 602 Publisher: Foreign Languages ??Press Easily Memorize the Equations: to help the candidates to easily memorize words. this book has increased mnemonic curse plate. to facilitate the candidate is able to effectively memory. Watch test sites: the classic example sentence with Zhenti similar. so that candidates learn how the word is applied to the examination while the word; test sites are summarized summed up in the words often test centers so that candidates can .
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New interconnection technology of integrated circuits in post-Moore era(Chinese Edition)
ISBN 10: 7030534182 ISBN 13: 9787030534187
£ 88.68
Convert currency£ 11.16 shipping from China to United KingdomQuantity: 3 available
Add to basketpaperback. Condition: New. Paperback. Pub Date: 2017-09-01 Pages: $number Language: Chinese Publisher: The Science Press the new interconnect technology of the post-Moore era for the interconnection problems of the post-Moore era integrated circuits. This paper focuses on the technology of Wafer interconnect based on carbon nanomaterials and silicon through-hole in three-dimensional integrated circuit. New interconnection of the post-Moore era IC .
