Seller: Hay-on-Wye Booksellers, Hay-on-Wye, HEREF, United Kingdom
Condition: Very Good. Minor wear at edges/corners. Faint storage scratches to cover. Some marks at parts of text blocks. Text as new and unread.
Published by Springer-Verlag GmbH, 2010
ISBN 10: 3642041566 ISBN 13: 9783642041563
Language: English
Seller: Buchpark, Trebbin, Germany
£ 86.80
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Seiten: 200 | Sprache: Englisch | Produktart: Bücher.
Published by Springer Berlin Heidelberg, 2010
ISBN 10: 3642041566 ISBN 13: 9783642041563
Language: English
Seller: moluna, Greven, Germany
£ 150.53
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Add to basketGebunden. Condition: New. A new integration scheme considering both performance and yieldNovel cost model to compare difference integration stylesDesign driven approach to prove the performance advantages of 2.5/3-D IC sFull EDA tool support for 3-D layout cr.
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
£ 128.99
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Published by Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Berlin, 2010
ISBN 10: 3642041566 ISBN 13: 9783642041563
Language: English
Seller: Grand Eagle Retail, Mason, OH, U.S.A.
£ 154.40
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Add to basketHardcover. Condition: new. Hardcover. "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA. "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Seller: Revaluation Books, Exeter, United Kingdom
Hardcover. Condition: Brand New. 200 pages. 9.25x6.00x0.50 inches. In Stock.