Rao R. Tummala
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
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Microelectronics Packaging Handbook: Technology Drivers Part I: 1
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
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View 24 offers£ 55.83
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Microelectronics Packaging Handbook on CD-ROM
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
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