John H. Lau

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BALL GRID ARRAY TECHNOLOGY (Electronic Packaging and Interconnection Series)
Lau, John

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� 2.76

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Solder Joint Reliability: Theory and Applications
Lau, John H.

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� 10.76

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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.

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� 6.22

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (Electronic Packaging and Interconnection Series)
Lau, John; Pao, Yi-Hsin

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� 16.79

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Handbook of Fine Pitch Surface Mount Technology

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� 9.18

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Flip Chip Technologies (Electronic Packaging and Interconnection Series)
Lau, John

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� 27.81

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Advanced MEMS Packaging (ELECTRONICS)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

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� 30.68

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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.

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� 37.12

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