John H. Lau

Popular items by John H. Lau

View all offers

Solder Joint Reliability: Theory and Applications
Lau, John H.

Item prices starting from

� 13.90

View 27 offers

Also find
New, Used, First Edition
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.

Item prices starting from

� 3.19

View 3 offers

Also find
Used
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.

Item prices starting from

� 26.73

View 15 offers

Also find
New, Used
Advanced MEMS Packaging (ELECTRONICS)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

Item prices starting from

� 30.92

View 12 offers

Also find
New, Used, First Edition
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.

Item prices starting from

� 52.33

View 25 offers

Also find
New
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (ELECTRONICS)
Lau, John H.

Item prices starting from

� 76.52

View 12 offers

Also find
New, Used
Semiconductor Advanced Packaging
Lau, John H.

Item prices starting from

� 89.95

View 39 offers

Also find
New, Used
Through-Silicon Vias for 3D Integration (ELECTRONICS)
Lau, John H.

Item prices starting from

� 82.78

View 12 offers

Also find
New, Used

Showing 8 of 25 titles