John H. Lau

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Solder Joint Reliability: Theory and Applications
Lau, John H.

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� 13.88

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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.

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� 3.19

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Handbook Of Tape Automated Bonding
Lau, John H.

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� 18.05

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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.

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� 29.09

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Advanced MEMS Packaging (ELECTRONICS)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

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� 30.89

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Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.

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� 52.26

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (ELECTRONICS)
Lau, John H.

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� 61.56

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Electronic Packaging: Design, Materials, Process, and Reliability (Electronic Packaging and Interconnection)
Lau, John H.; Nakayama, Wataru; Prince, John; Wong, C.P.

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� 185.21

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