John H. Lau

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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.

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� 3.18

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Solder Joint Reliability: Theory and Applications
Lau, John H.

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� 10.76

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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.

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� 27.58

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Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.

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� 52.03

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Through-Silicon Vias for 3D Integration (ELECTRONICS)
Lau, John H.

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� 84.12

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (ELECTRONICS)
Lau, John H.

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� 77.99

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Semiconductor Advanced Packaging
Lau, John H.

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� 71.66

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Electronic Packaging: Design, Materials, Process, and Reliability (Electronic Packaging and Interconnection)
Lau, John H.; Nakayama, Wataru; Prince, John; Wong, C.P.

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� 89.11

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