John H. Lau

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Solder Joint Reliability: Theory and Applications
Lau, John H.

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� 13.79

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Handbook Of Tape Automated Bonding
Lau, John H.

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� 17.93

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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.

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� 29.09

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Advanced MEMS Packaging (ELECTRONICS)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

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� 30.69

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Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.

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� 51.92

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects (ELECTRONICS)
Lau, John H.

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� 61.16

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Through-Silicon Vias for 3D Integration (ELECTRONICS)
Lau, John H.

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� 83.17

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Electronic Packaging: Design, Materials, Process, and Reliability (Electronic Packaging and Interconnection)
Lau, John H.; Nakayama, Wataru; Prince, John; Wong, C.P.

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� 184

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