John H. Lau

Popular items by John H. Lau

View all offers

Solder Joint Reliability: Theory and Applications
Lau, John H.

Item prices starting from

� 13.84

View 28 offers

Also find
New, Used, First Edition
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Lau, John H.

Item prices starting from

� 3.18

View 3 offers

Also find
Used
Handbook Of Tape Automated Bonding
Lau, John H.

Item prices starting from

� 18

View 13 offers

Also find
New, Used
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Lau, John H.

Item prices starting from

� 28.79

View 9 offers

Also find
New, Used
Advanced MEMS Packaging (ELECTRONICS)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu

Item prices starting from

� 30.81

View 11 offers

Also find
New, Used, First Edition
Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.

Item prices starting from

� 52.12

View 23 offers

Also find
New
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (ELECTRONICS)
Lau, John H.

Item prices starting from

� 61.39

View 14 offers

Also find
New, Used, First Edition
Electronic Packaging: Design, Materials, Process, and Reliability (Electronic Packaging and Interconnection)
Lau, John H.; Nakayama, Wataru; Prince, John; Wong, C.P.

Item prices starting from

� 184.71

View 3 offers

Also find
New

Showing 8 of 25 titles