Ken Gilleo
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Polymer Thick Film: Today's emerging technology for a clean environment tomorrow (Electrical Engineering)
Gilleo, Ken
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Area Array Packaging Processes: for BGA, Flip Chip, and CSP
Gilleo, Ken
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Area Array Packaging Handbook: Manufacturing and Assembly (McGraw-Hill Packaging and Electronics Books)
Gilleo, Ken
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Area Array Package Design: Techniques in High Density Electronics
Gilleo, Ken
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MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes (MECHANICAL ENGINEERING)
Gilleo, Ken
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View 7 offers£ 170.99
