Wafer Level 3-D ICs Process Technology
Language: English
Published by Springer US, 2008
- Hardcover
- New
Condition: New
£ 118.70
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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Focuses on the foundry-based process technology for the fabrication of 3-D ICsDiscusses the technology platform for pre-packaging wafer level 3-D ICsIncludes chapters contributed by various experts in the field of wafer-level 3-D ICs proces.
Seller Inventory # 5911042
- Title
- Wafer Level 3-D ICs Process Technology
- Author
- Tan, Chuan Seng|Reif, L. Rafael|Gutmann, Ronald J.
- Publisher
- Springer US
- Publication year
- 2008
- Condition
- New
- Binding
- Gebunden
- Language
- English
- ISBN 10
- 0387765328
- ISBN 13
- 9780387765327
- Series
- Book 20 of 34: Integrated Circuits and Systems
"Synopsis" may belong to another edition of this title.
From the Back Cover
Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration.
Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.
"About the title" may belong to another edition of this title.
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