Ultra-Low Power Wireless Technologies for Sensor Networks

Language: English

Published by Springer Us Apr 2007, 2007

0387309306 / 9780387309309

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -transconductance e ciency of all critical devices in order to reduce the n- essary bias current. However, reducing the current density also results in a severely decreased device f . An optimization of the current density is re- T quired to provide the correct balance between transconductance e ciency and bandwidth. Plots such as Figure 2. 1 are useful tools for designers when choosing appropriate transistor bias points. Technology scaling allows greatly increased f realization for a given IC. Thus, weak inversion biasing for RF T design will become increasingly useful in future technology nodes. Throughout this work, the IC of critical transistors will be discussed. Most of the RF devices are biased in moderate to weak inversion to achieve enhanced transconductance e ciency and reduced bias current. 2. 2 MEMS Background The relatively new eld of Radio Frequency Microelectro Mechanical Systems (RF MEMS) provides unique opportunities for RF transceiver designers. This section provides background on RF MEMS and provides insight into the - portunities presented by these new technologies. The eld of RF MEMS - cludes the design and utilization of RF lters, resonators, switches, and other passive mechanical structures constructed using bulk processed integrated c- cuit fabrication techniques. To date, these devices have been commercially used as discrete board-mounted components, primarily used to enhance the miniaturization of mobile phones. However, RF MEMS components have the potential to be batch fabricated using existing integrated circuit fabrication techniques. 184 pp. Englisch.

Seller Inventory # 9780387309309

Title
Ultra-Low Power Wireless Technologies for Sensor Networks
Author
Brian Otis
Publisher
Springer Us Apr 2007
Publication year
2007
Condition
Neu
Binding
Buch
Language
English
ISBN 10
0387309306
ISBN 13
9780387309309
Item weight
463 grams
Dimensions
240x158x16 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

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BuchWeltWeit Ludwig Meier e.K.

Germany