Topics in Modal Analysis & Parameter Identification, Volume 8

Brandon J. Dilworth

ISBN 10: 303105444X / ISBN 13: 9783031054440

Published by Springer International Publishing, Springer International Publishing Aug 2022, 2022

About this Item

Neuware -Topics in Modal Analysis & Testing, Volume 8: Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics, 2022, the eighth volume of nine from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Modal Analysis, including papers on:Operational Modal & Modal Analysis ApplicationsExperimental TechniquesModal Analysis, Measurements & Parameter EstimationModal Vectors & ModelingBasics of Modal AnalysisAdditive Manufacturing & Modal Testing of Printed PartsSpringer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.

Seller Inventory # 9783031054440

Bibliographic Details

• Title: Topics in Modal Analysis & Parameter Identification, Volume 8
• Publisher: Springer International Publishing, Springer International Publishing Aug 2022
• Publication Date: 2022
• Language: English
• ISBN 10: 303105444X
• ISBN 13: 9783031054440
• Binding: Buch
• Condition: Neu

About this title

Synopsis

Topics in Modal Analysis & Testing, Volume 8: Proceedings of the 40th IMAC, A Conference and Exposition on Structural Dynamics, 2022, the eighth volume of nine from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Modal Analysis, including papers on:

Operational Modal & Modal Analysis Applications

Experimental Techniques

Modal Analysis, Measurements & Parameter Estimation

Modal Vectors & Modeling

Basics of Modal Analysis

Additive Manufacturing & Modal Testing of Printed Parts

About the Author

 Brandon Dilworth, MIT Lincoln Laboratory, MA, USA; Timothy Marinone, ATA Engineering, Inc., CA, USA; Michael Mains, University of Cincinnati, Ohio, USA