Three Dimensional System Integration : IC Stacking Process and Design

Language: English

Published by Springer Us, 2010

1441909613 / 9781441909619

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

Seller Inventory # 9781441909619

Title
Three Dimensional System Integration : IC Stacking Process and Design
Author
Riko Radojcic
Publisher
Springer Us
Publication year
2010
Condition
Neu
Binding
Buch
Language
English
ISBN 10
1441909613
ISBN 13
9781441909619
Item weight
527 grams
Dimensions
241x164x23 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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