Three Dimensional System Integration : IC Stacking Process and Design

Language: English

Published by Springer, 2014

1489981829 / 9781489981820

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Softcover

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Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.…

Seller Inventory # 9781489981820

Title
Three Dimensional System Integration : IC Stacking Process and Design
Author
Riko Radojcic
Publisher
Springer
Publication year
2014
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
1489981829
ISBN 13
9781489981820
Item weight
394 grams
Dimensions
235x155x15 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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