Three Dimensional System Integration

Language: English

Published by SPRINGER US Dez 2010, 2010

1441909613 / 9781441909619

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 246 pp. Englisch.

Seller Inventory # 9781441909619

Title
Three Dimensional System Integration
Author
Antonis Papanikolaou
Publisher
SPRINGER US Dez 2010
Publication year
2010
Condition
Neu
Binding
Buch
Language
English
ISBN 10
1441909613
ISBN 13
9781441909619
Item weight
527 grams
Dimensions
241x164x23 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
First item£ 19.72£ 19.72
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BuchWeltWeit Ludwig Meier e.K.

Germany