Three Dimensional System Integration

Language: English

Published by Springer US Sep 2014, 2014

1489981829 / 9781489981820

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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Softcover

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This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. 256 pp. Englisch.…

Seller Inventory # 9781489981820

Title
Three Dimensional System Integration
Author
Antonis Papanikolaou
Publisher
Springer US Sep 2014
Publication year
2014
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
1489981829
ISBN 13
9781489981820
Item weight
394 grams
Dimensions
235x155x15 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
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BuchWeltWeit Ludwig Meier e.K.

Germany