Three-Dimensional Integrated Circuit Design

Vasilis F Pavlidis

ISBN 10: 0123743435 / ISBN 13: 9780123743435

Published by Elsevier Science Sep 2008, 2008

About this Item

This item is printed on demand - it takes 3-4 days longer - Neuware -With vastly increased complexity and functionality in the 'nanometer era' (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future.This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.Demonstrates how to overcome 'interconnect bottleneck' with 3-D integrated circuit design.leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designersThe FIRST book on 3-D integrated circuit design.provides up-to-date information that is otherwise difficult to findFocuses on design issues key to the product development cycle.good design plays a major role in exploiting the implementation flexibilities offered in the 3-DProvides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization.offers practical view of designing 3-D circuits 336 pp. Englisch.

Seller Inventory # 9780123743435

Bibliographic Details

• Title: Three-Dimensional Integrated Circuit Design
• Publisher: Elsevier Science Sep 2008
• Publication Date: 2008
• Language: English
• ISBN 10: 0123743435
• ISBN 13: 9780123743435
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 243W x 197H x 25D millimeters 243 millimeters width by 197 millimeters height by 25 millimeters depth
• Weight: 852 grams

About this title

Synopsis

With vastly increased complexity and functionality in the 'nanometer era' (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.

About the Author

Vasilis F. Pavlidis received the B.S. and M.Eng. in electrical and computer engineering from the Democritus University of Thrace, Xanthi, Greece, in 2000 and 2002, respectively. He received the M.Sc. and Ph.D. degrees from, University of Rochester, Rochester, NY in 2003 and 2008, respectively. From 2000 to 2002, he was with INTRACOM S.A. Athens, Greece. In summer of 2007, he was with Synopsys Inc. Mountain View, California. His current research interests are in the area of interconnect modeling, 3-D integration, networks-on-chip, and related design issues in VLSI.