Thermal Stress and Strain in Microelectronics Packaging

Language: English

Published by Van Nostrand Reinhold, 1993

0442010583 / 9780442010584

  • Hardcover
  • Used
See all details

Seller: Bookmans, tucson, AZ, U.S.A.Bookmans

5-star seller

AbeBooks seller since April 30, 2007

Hardcover

Condition: Used - Fair

£ 125.45

£ 3.02 shipping 
Ships within U.S.A.

Quantity: 1 available

Add to basket
Free 30-day returns

Item description from seller

Highlighting/Underlining/Notes etc. Satisfaction 100% guaranteed.

Seller Inventory # mon0002769321

Title
Thermal Stress and Strain in Microelectronics Packaging
Publisher
Van Nostrand Reinhold
Publication year
1993
Condition
Acceptable
Binding
hardcover
Language
English
ISBN 10
0442010583
ISBN 13
9780442010584

Bookmans

tucson, AZ, U.S.A.

5-star seller

AbeBooks seller since April 30, 2007

Shipping rates within U.S.A.

Item4 to 14 business days2 to 6 business days
First item£ 3.02£ 7.56
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.

Payment methods

  • Visa
  • Mastercard
  • American Express
  • Apple Pay
  • Google Pay

Seller's business information

bookmans

9550 E Golf Links Rc
tucson, AZ U.S.A. 85730