Thermal Management for Opto-Electronics Packaging and Applications
Language: English
Published by Wiley Aug 2024, 2024
- Hardcover
- New
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
AbeBooks seller since August 14, 2006
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Add to basketItem description from seller
Neuware - A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: - A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials - Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling - Practical discussions of thermally enhanced thermal interfacial materials (TIMs) - Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.…
Seller Inventory # 9781119179276
- Title
- Thermal Management for Opto-Electronics Packaging and Applications
- Author
- Xiaobing Luo
- Publisher
- Wiley Aug 2024
- Publication year
- 2024
- Condition
- Neu
- Binding
- Buch
- Language
- English
- ISBN 10
- 1119179270
- ISBN 13
- 9781119179276
- Item weight
- 1,179 grams
- Dimensions
- 251x175x33 mm
A systematic guide to the theory, applications, and design of thermal management for LED packaging
In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design.
The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems.
The book also includes:
- A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials
- Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling
- Practical discussions of thermally enhanced thermal interfacial materials (TIMs)
- Complete treatments of hybrid thermal management in downhole devices
Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
"Synopsis" may belong to another edition of this title.
About the Author
Xiaobing Luo, PhD, is a Full Professor at School of Energy and Power Engineering, Huazhong University of Science and Technology, China. He is IEEE Fellow and ASME Fellow. He has extensive research experience in thermal management field. He has published more than 200 academic papers and invented novel micro hydraulic suspension pump for liquid cooling system.
Run Hu, PhD, is a Professor and Doctoral Supervisor at the School of Energy and Power Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Outstanding Youth Scholar and Chutian Scholar awards in Hubei province.
Bin Xie, PhD, is an Assistant Professor at the School of Mechanical Science and Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Natural Science Prize of Hubei Province (second class) and the Outstanding Paper Award from the International Conference on Electronic Packaging Technology (ICEPT).
"About the title" may belong to another edition of this title.
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