Static Crosstalk-Noise Analysis: For Deep Sub-Micron Digital Designs (Solid Mechanics & Its Applications S)

Pinhong Chen; Kirkpatrick, Desmond A.; Keutzer, Kurt

ISBN 10: 1402080913 / ISBN 13: 9781402080913

Published by Springer, 2004

About this Item

The binding is tight and the spine is smooth. The cover has a couple of minor dents along the lower half in front and a slight dent along the front edge, near the middle. The bottom corners are lightly bumped. The pages are clean and unmarked and the book appears to be only lightly used. The previous owned has written their name on the inside of the front cover at the top but there are no other marks inside.
From the back cover: "All signoff analyses-timing, coupling, power, temperature, and reliability-rely on the analysis of crosstalk noise. This book is an important contribution to the field." 113 pp. Shelf: D-2.

Seller Inventory # 251102LW

Bibliographic Details

• Title: Static Crosstalk-Noise Analysis: For Deep Sub-Micron Digital Designs (Solid Mechanics & Its Applications S)
• Publisher: Springer
• Publication Date: 2004
• Language: English
• ISBN 10: 1402080913
• ISBN 13: 9781402080913
• Binding: Hardcover
• Condition: Very Good
• Dust Jacket Condition: No Jacket
• Dimensions: 0.51W x 16.2H x 24.44D centimeters 0.51 centimeters width by 16.2 centimeters height by 24.44 centimeters depth
• Weight: 0.463 pounds
• Seller catalogs:
  • NONFICTION
  • Education
  • Science

About this title

Synopsis

As the feature size decreases in deep sub-micron designs, coupling capacitance becomes the dominant factor in total capacitance. The resulting crosstalk noise may be responsible for signal integrity issues and significant timing variation. Traditionally, static timing analysis tools have ignored cross coupling effects between wires altogether. Newer tools simply approximate the coupling capacitance by a 2X Miller factor in order to compute the worst case delay. The latter approach not only reduces delay calculation accuracy, but can also be shown to underestimate the delay in certain scenarios.
This book describes accurate but conservative methods for computing delay variation due to coupling. Furthermore, most of these methods are computationally efficient enough to be employed in a static timing analysis tool for complex integrated digital circuits. To achieve accuracy, a more accurate computation of the Miller factor is derived. To achieve both computational efficiency and accuracy, a variety of mechanisms for pruning the search space are detailed, including:

-Spatial pruning - reducing aggressors to those in physical proximity,
-Electrical pruning - reducing aggressors by electrical strength,
-Temporal pruning - reducing aggressors using timing windows,
-Functional pruning - reducing aggressors by Boolean functional analysis.

Review

"Finally, a detailed analysis of the silicon interconnect coupling problem! This book not only addresses the coupling noise problem, but formulates and proposes usable CAD algorithms. Since the uncertainty in silicon design performance and reliability due to increasing coupling noise will only get worse each silicon generation, these algorithms will quickly find a gratefulhome in many CAD solutions."
(William J. Grundmann, Intel Fellow, Intel Corporation)
"All signoff analyses - timing, coupling, power, temperature, and reliability - rely on the analysis of crosstalk noise. This book is an important contribution to the field: it provides a synthesis of analytic bounding of crosstalk effects, switching window convergence, and other recent elements of crosstalk methodology. It provides a level of understanding that will be essential for researchers, developers, and users of leading EDA tools going forward."
(Andrew B. Kahng, Professor of CSE and ECE, University of California, San Diego)