Solder Joint Technology : Materials, Properties, and Reliability

Language: English

Published by Springer, 2010

1441922849 / 9781441922847

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Softcover

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Druck auf Anfrage Neuware - Printed after ordering - Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Seller Inventory # 9781441922847

Title
Solder Joint Technology : Materials, Properties, and Reliability
Author
King-Ning Tu
Publisher
Springer
Publication year
2010
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
1441922849
ISBN 13
9781441922847
Item weight
587 grams
Dimensions
235x155x21 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

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AHA-BUCH GmbH

Garlebsen 48
Einbeck, Germany 37574