SiC Power Module Design
Language: English
Published by Institution of Engineering and Technology, GB, 2022
- Hardcover
- New
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
AbeBooks seller since June 11, 2025
Condition: New
£ 153.06
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Add to basketItem description from seller
High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.…
Seller Inventory # LU-9781785619076
- Title
- SiC Power Module Design
- Author
- Castellazzi, Alberto
- Publisher
- Institution of Engineering and Technology, GB
- Publication year
- 2022
- Condition
- New
- Binding
- Hardback
- Language
- English
- ISBN 10
- 1785619071
- ISBN 13
- 9781785619076
- Series
- Book 64 of 65: Energy Engineering
High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging.
This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs.
Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.
"Synopsis" may belong to another edition of this title.
About the Author
Alberto Castellazzi is a professor at the Kyoto University of Advanced Science, Japan. His research focuses on advanced solid-state power processing, including the characterization and use of wide-band-gap semiconductor devices. He has 20 years' experience in power electronics R&D from both industry and academia, including University of Nottingham, UK, SIEMENS (Germany), ETH Zurich (Switzerland), and ALSTOM (France). He is a member of The Power Electronic Conversion Technology Annex (PECTA) of the IEA.
Andrea Irace is a professor of electronics at the University of Naples Federico II, Italy. His research focuses on modelling and simulation of WBG devices for power electronics. Prior assignments included the Delft Institute of Microelectronics and Submicron Technology. He has authored more than 120 papers in international publications.
"About the title" may belong to another edition of this title.
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