Semiconductor Packaging : Materials Interaction and Reliability
Language: English
Published by CRC Press, 2017
- Softcover
- New
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Condition: New
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Add to basketItem description from seller
nach der Bestellung gedruckt Neuware - Printed after ordering - In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.…
Seller Inventory # 9781138075405
- Title
- Semiconductor Packaging : Materials Interaction and Reliability
- Author
- Andrea Chen
- Publisher
- CRC Press
- Publication year
- 2017
- Condition
- Neu
- Binding
- Taschenbuch
- Language
- English
- ISBN 10
- 113807540X
- ISBN 13
- 9781138075405
- Item weight
- 339 grams
- Dimensions
- 234x156x12 mm
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.
The book focuses on an important step in semiconductor manufacturing―package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.
By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
"Synopsis" may belong to another edition of this title.
About the Author
Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.
Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.
"About the title" may belong to another edition of this title.
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