Semiconductor Packaging

Language: English

Published by Taylor and Francis Inc, US, 2011

1439862052 / 9781439862056

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Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.…

Seller Inventory # LU-9781439862056

Title
Semiconductor Packaging
Author
Andrea Chen, Randy Hsiao-Yu Lo
Publisher
Taylor and Francis Inc, US
Publication year
2011
Condition
New
Binding
Hardback
Language
English
ISBN 10
1439862052
ISBN 13
9781439862056
Item weight
453 grams

Rarewaves.com UK

London, United Kingdom

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