Rheology and processing of pastes for electronic packaging materials : Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives

Language: English

Published by VDM Verlag Dr. Müller, 2009

363915746X / 9783639157468

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Softcover

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nach der Bestellung gedruckt Neuware - Printed after ordering - The stencil printing of pastes (solder paste andelectrical conductive adhesives) is a very importantstage in the assembly of electronic packages. Thereis wide agreement in industry that the paste printingprocess accounts for the majority of assemblydefects, which originate from poor understanding ofthe correlation between the paste rheology and theprinting process. The development of new pastesformulations is a complex process. As a result moreextensive rheological characterisation techniques arerequired to understand the flow behaviour of thepastes under different shear conditions. This bookfocuses on the rheological characterisation of pastesand their correlation to the stencil printingprocess. A general guideline has been developed fromthe extensive set of results from this research, inparticular, on the aspect of correlating key pasteperformance indicators to the rheological testmethods. The book is aimed at paste and electronicmanufacturers with an interest of incorporatingrheology as a research and quality assurance tool intheir formulation and production processes.…

Seller Inventory # 9783639157468

Title
Rheology and processing of pastes for electronic packaging materials : Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives
Author
Rajkumar Durairaj
Publisher
VDM Verlag Dr. Müller
Publication year
2009
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
363915746X
ISBN 13
9783639157468
Item weight
177 grams
Dimensions
220x150x7 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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