Rheological Characterisation and Modelling of Electronic Materials

Language: English

Published by LAP LAMBERT Academic Publishing Nov 2010, 2010

3843377715 / 9783843377713

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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Softcover

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This item is printed on demand - it takes 3-4 days longer - Neuware -The two most important trends in electronic industry are miniaturisation and increased functionality . As these trends are set to continue, there is an increasing demand for better understanding of soldering technology, particularly in the area of solder pastes used in the reflow soldering of surface mount devices. This means that the paste flow and deformation behaviour is very important in defining the printing performance of any solder paste. The work reported in this book is focused on experimetal investigation and empirical modelling of time-dependent rheological behaviours of solder paste and flux mediums. The printing trials of four different lead-free solder paste samples were also carried out to investigate the effect of post-print rest period on slumping behaviour of solder paste. The paste manufacturers and formulators can use the techniques developed to predict and quantify the slumping behaviour of solder paste.The end-users, for example the electronics assemblers may use the techniques to optimize their assembly process by minimising/preventing slumping of solder paste. 224 pp. Englisch.…

Seller Inventory # 9783843377713

Title
Rheological Characterisation and Modelling of Electronic Materials
Author
Sabuj Mallik
Publisher
LAP LAMBERT Academic Publishing Nov 2010
Publication year
2010
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3843377715
ISBN 13
9783843377713
Item weight
352 grams
Dimensions
220x150x14 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

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BuchWeltWeit Ludwig Meier e.K.

Germany