Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 | Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics
Antonio Baldi (u. a.)
ISBN 10: 3030300978 ISBN 13: 9783030300975
Published by Springer, 2020
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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 | Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics | Antonio Baldi (u. a.) | Buch | viii | Englisch | 2020 | Springer | EAN 9783030300975 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Seller Inventory # 117024358
Synopsis:
Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Test Design and Inverse Method Algorithms
Inverse Problems: Virtual Fields Method
Residual Stresses: Measurement, Uncertainty & Validation
Residual Stresses: Eigenvalues, Modeling, & Crack Growth
Material Characterizations Using Thermography
Fatigue, Damage & Fracture Evaluation Using Infrared Thermography
About the Author:
Antonio Baldi – University of Cagliari, Sardinia, Italy; Xavier Balandraud – Sigma Clermont Engineering School, France; Sharlotte L.B. Kramer – Sandia National Laboratories, Albuquerque, NM, USA; Fabrice Pierron – University of Southampton, Southampton, UK; John Considine - United States Forrest Service, Madison, WI, USA; Sven Bossuyt – Aalto University, Aalto, Finland; Johan Hoefnagels – Eindhoven University of Technology, Eindhoven, Netherlands.
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Bibliographic Details
Title: Residual Stress, Thermomechanics & Infrared ...
Publisher: Springer
Publication Date: 2020
Binding: Buch
Condition: Neu