Reliability and Failure Analysis of High Power Led Packaging
Language: English
Published by Elsevier Science, 2022
- Softcover
- New
Seller: moluna, Greven, Germanymoluna
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Condition: New
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Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs .
Seller Inventory # 440112161
- Title
- Reliability and Failure Analysis of High Power Led Packaging
- Author
- Cher Ming Tan|Preetpal Singh
- Publisher
- Elsevier Science
- Publication year
- 2022
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 0128224088
- ISBN 13
- 9780128224083
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs.
The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.
- Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them
- Describes the chemistry underlying the material degradation and its impact on LEDs
- Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
"Synopsis" may belong to another edition of this title.
About the Author
Dr. Preetpal Singh received his BS from the Guru Nanak Engineering College, Hyderabad, India, in 2007, and MS from Amity University, Noida, India, in 2013. He completed his PhD in 2018 with the Department of Electronic Engineering and Center for Reliability Sciences and Technologies (CReST), Chang Gung University in Taoyuan, Taiwan. His research interests include graphene-based high-power LEDs, high-power LED degradation study, and LED reliability. He has published his research in reputed journals like the IEEE-TDMR, Microelectronics Reliability, and Scientific Reports. He holds a US patent for his work on High Power LEDs substrate―GaN thermal and lattice mismatch improvement. He is also the Reviewer for the IEEE-TDMR and microelectronics journals. Presently he is working with Epistar, Taiwan, as Senior Research Engineer and is responsible for development of different types of LEDs.
"About the title" may belong to another edition of this title.
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