Recent Trends in VLSI and Semiconductor Packaging
Language: English
Published by Taylor and Francis Ltd, GB, 2025
- Softcover
- New
Seller: Rarewaves.com USA, London, London, United KingdomRarewaves.com USA
AbeBooks seller since June 11, 2025
Condition: New
£ 101.12
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Add to basketItem description from seller
The International conference on Semiconductor Materials packaging, AIandML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("SMART-2024") aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "SMART-2024" seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.
Seller Inventory # LU-9781041017875
- Title
- Recent Trends in VLSI and Semiconductor Packaging
- Author
- T. Vasudeva Reddy
- Publisher
- Taylor and Francis Ltd, GB
- Publication year
- 2025
- Condition
- New
- Binding
- Paperback
- Language
- English
- ISBN 10
- 1041017871
- ISBN 13
- 9781041017875
- Item weight
- 1,560 grams
The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.
"Synopsis" may belong to another edition of this title.
About the Author
T. Vasudeva Reddy is an Associate Professor in Electronics and Communication Engineering (ECE), B V RAJU Institute of Technology, Narsapur. His expertise lies in enhancing electronic system efficiency, focusing on power consumption, area utilization, and signal delay optimization. His research encompasses Low Power SRAM Architectures, Sub-threshold SRAM Designs, and MEMS Devices for Coagulation Effect, supported by a rich publication record and a commitment to innovative research.
K. Madhava Rao, Assistant Professor at B V RAJU Institute of Technology, Narsapur since 2016, boasts a comprehensive exploration and contribution to electronics and communication engineering. His research covers hardware implementation, low-power techniques, FPGA-based systems, and advanced memory designs, presented at international conferences and esteemed journals.
"About the title" may belong to another edition of this title.
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