Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition
Language: English
Published by CRC Press Jun 2016, 2016
- Hardcover
- New
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Add to basketItem description from seller
Neuware - Successfully Estimate the Thermal and Mechanical Characteristics of Electronics SystemsA definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.Additionally, the author: - Addresses various cross-discipline issues in the design of electromechanical products - Provides a solid foundation for heat transfer, vibration, and life expectancy calculations - Identifies reliability issues and concerns - Develops the ability to conduct a more thorough analysis for the final design - Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, - electrical or quality engineering.…
Seller Inventory # 9781498753951
- Title
- Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis, Third Edition
- Author
- Ali Jamnia
- Publisher
- CRC Press Jun 2016
- Publication year
- 2016
- Condition
- Neu
- Binding
- Buch
- Language
- English
- ISBN 10
- 1498753957
- ISBN 13
- 9781498753951
- Edition
- 3rd Edition
- Item weight
- 680 grams
- Dimensions
- 234x163x25 mm
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems
A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration.
Additionally, the author:
- Addresses various cross-discipline issues in the design of electromechanical products
- Provides a solid foundation for heat transfer, vibration, and life expectancy calculations
- Identifies reliability issues and concerns
- Develops the ability to conduct a more thorough analysis for the final design
- Includes design tips and guidelines for each aspect of electronics packaging
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering."Synopsis" may belong to another edition of this title.
About the Author
Ali Jamnia enjoys teaching and mentoring junior engineers. His primary expertise lies in electromechanical systems design and development. In addition, he enjoys conducting analysis of various engineering problems using numerical approximations and computer simulations. Dr. Jamnia has focused on the issues of electronics packaging since the early 1990s, and since 1995, has been involved with the development of innovative electronics systems to aid individuals with either physical or cognitive disabilities. In fact, his prime achievement has been the development of a specialized computer system called the Learning StationTM - used as a teaching tool for individuals with cognitive disabilities.
"About the title" may belong to another edition of this title.
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