OPTIMIZATION OF THERMAL AWARE MULTILEVEL ROUTING FOR 3D IC

Language: English

Published by LAP Lambert Academic Publishing, 2022

6204741314 / 9786204741314

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Very Large Scale Integration (VLSI) is a process of creating an integrated circuit by linking a large number of transistors into a single chip. A 3D IC provides a positive effect on both execution and wirelength in a power system. A three dimensional integr.

Seller Inventory # 567324681

Title
OPTIMIZATION OF THERMAL AWARE MULTILEVEL ROUTING FOR 3D IC
Author
K, Pandiaraj
Publisher
LAP Lambert Academic Publishing
Publication year
2022
Condition
New
Binding
Kartoniert / Broschiert
Language
English
ISBN 10
6204741314
ISBN 13
9786204741314

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item26 to 60 business days26 to 60 business days
First item£ 41.03£ 41.03
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