Nondestructive Testing Handbook, Volume 3: Infrared and Thermal Testing (Third Edition)

Oversized & heavy hardcover, xiii + 718 pages, NOT ex-library. Shipping weight over 2kg. Interior is clean and bright throughout with unmarked text, free of inscriptions and stamps, firmly bound. Gently bumped upper outer corner of the rear board: resulting in an indentation with short creases, and minor wear to the tips of corners of last pages. Some faint dusty handling marks on page edges externally. Issued without a dust jacket. -- This volume provides a comprehensive technical overview of infrared and thermal testing methods used in nondestructive testing (NDT), situating them in both theoretical and applied contexts. It consists of 20 chapters, each addressing a specific facet of infrared thermography, from foundational physics to advanced industry-specific implementations. The content is intended for engineers, researchers, certification candidates, and professionals working in materials diagnostics and quality assurance. The opening chapters introduce the physical basis for infrared testing. Chapters 1-3 cover general NDT principles, heat transfer mechanisms, and distinctions between passive and active thermography. These sections lay out essential knowledge on thermal conduction, diffusion, and the modeling of heat behavior in solid materials. Special attention is given to how thermal patterns emerge in response to defects or discontinuities and how this can be exploited for inspection. Chapters 4-7 focus on radiometry, emissivity, signal processing, measurement uncertainty, and instrumentation calibration. These sections establish the conditions under which reliable imaging is possible, addressing system noise, surface effects, and atmospheric influences. Together, they explain how to maximize signal integrity and interpret temperature data in varied operational contexts. Sensor technologies are detailed in Chapters 8 and 9, covering both non-contact thermal imagers and contact-based devices like thermocouples and liquid crystals. Each sensor type is evaluated for accuracy, thermal response, spatial resolution, and application fit. Chapter 10 transitions from component-level descriptions to system-level operation, explaining how thermal imaging systems are configured and used in the field. Chapter 11 provides a taxonomy of thermographic methods, such as pulse thermography, lock-in thermography, and thermoelastic stress analysis. Comparative advantages and energy delivery mechanisms are examined. Chapter 12 covers data acquisition, signal interpretation, and advanced image reconstruction tools, including thermal tomography and defect depth estimation. Defect analysis and modeling are addressed in Chapters 13 and 14. These chapters describe contrast modeling techniques, one- and two-dimensional heat flow simulations, and practical examples in metals processing, including real-time monitoring of manufacturing operations. Chapters 15-19 present applications across five industrial sectors. Aerospace uses include composite inspection and impact damage analysis. The power industry section discusses thermal monitoring of electrical and reactor systems. The chemical and petroleum chapter outlines leak detection and tank inspection protocols. Infrastructure applications span building envelope surveys and historic structure diagnostics. Electronics coverage includes circuit board testing and thermal profiling at the micro scale. Chapter 20 concludes with terminology and nomenclature relevant to thermal NDT, supporting standardization in technical communication and training. By uniting physical modeling, instrumentation, procedural methods, and application examples, the book offers a multi-level resource suitable for both study and field application. It bridges theory and practice, supporting its use in professional certification, engineering instruction, and applied diagnostics in sectors where thermography informs maintenance, quality control, and safety evaluations.…