Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Language: English

Published by Springer Netherlands Apr 1993, 1993

185166579X / 9781851665792

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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Item description from seller

This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field. 260 pp. Englisch.

Seller Inventory # 9781851665792

Title
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
Author
K. Otsuka
Publisher
Springer Netherlands Apr 1993
Publication year
1993
Condition
Neu
Binding
Buch
Language
English
ISBN 10
185166579X
ISBN 13
9781851665792
Item weight
559 grams
Dimensions
241x160x19 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

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BuchWeltWeit Ludwig Meier e.K.

Germany

BuchWeltWeit Inh. Ludwig Meier e.K.
Inhaber: Ludwig Meier
De-Gasperi-Str. 8
51469 Bergisch Gladbach
Deutschland

Tel.: +49(0)22028659300
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