This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it. 892 pp. Englisch.

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Bibliographic Details

Title: MicroSystem Based on SiP Technology
Publisher: Springer Nature Singapore, Springer Nature Singapore Mai 2023
Publication Date: 2023
Language: English
ISBN 10: 981190085X
ISBN 13: 9789811900853
Binding: Taschenbuch
Condition: Neu
Dimensions: 235 millimeters width by 155 millimeters height by 48 millimeters depth
Weight: 1323 grams

About this title

Synopsis

This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters.

In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si�P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.

Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.

Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.

This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.

Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

About the Author

Mr. Suny Li (Li Yang) is a SiP technical expert with 20 years of working experience. He has participated and guided more than 40 SiP projects in China.

In 2021, he published the technical book "Micro System Base on SiP Technology" (PHEI); in 2017, he published the English technical book "SiP system-in-package design and simulation" (WILEY). In 2012, he published the technical book "SiP system level package design and simulation" (PHEI).

Suny Li has worked in NSSC (National Space Science Center) of the CAS (Chinese Academy of Sciences) and participated in the ShenZhou series of Manned Space Flight Program and the DSP (Double Star Exploration Program), an ESA and NSSC cooperative space science project. Then, he attended SIEMENS China. In 2007, He joined AcconSys.

Suny Li is a senior member of IEEE, a senior member of Chinese institute of Electronics and a senior member of the China Graphics Society. He has obtained more than ten national patents andpublished more than ten papers.

Suny graduated from BEIHANG University with a master's degree in Aerospace Science and Technology.

At present, Suny is working as a technical expert responsible for SiP and MicroSystem product development, as well as EDA software technical support related to SiP and IC packaging design.

"About this title" may belong to another edition of this title.

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