Life-Time Estimation of Modern Power Electronics Devices : Power cycling capability of advanced packaging and interconnection technologies at high temperature swings

Language: English

Published by Noor Publishing, 2017

3330852569 / 9783330852563

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Softcover

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nach der Bestellung gedruckt Neuware - Printed after ordering - Due to the increasing advancements in power devices, especially in Insulated Gate Bipolar Transistors (IGBT) technology, switching of kV and kA within mis is possible. Thereby a dissipation power up to 400W per chip is generated. Compared to the switched power, the dissipated power is still marginal. However, considering the area within this power is generated ( 2cm2), a significant heat density and thus high temperature especially within the chip is generated. To keep the maximal junction temperature (Tj,max) within the allowed range, reliable, thermally convenient packaging and interconnection concepts are necessary. Furthermore, power devices find increasingly application in automobile industry, where they have to fulfil high reliability requirements under harsh environmental conditions during their service lifetime of approx. 15 years.

Seller Inventory # 9783330852563

Title
Life-Time Estimation of Modern Power Electronics Devices : Power cycling capability of advanced packaging and interconnection technologies at high temperature swings
Author
Raed Amro
Publisher
Noor Publishing
Publication year
2017
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3330852569
ISBN 13
9783330852563
Item weight
221 grams
Dimensions
220x150x9 mm

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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Einbeck, Germany 37574