Investigation of Triple Line Energy in Copper with Atomic Force Microscopy

Language: English

Published by Cuvillier Nov 2011, 2011

3869559462 / 9783869559469

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -In this study, the grain boundary-free surface line tension and grain boundary triple line tension were investigated on copper polycrystals, nanowires, and tricrystals through a thermodynamically correct approach which allows a direct and precise measurement of the line tension. The grain boundary-free surface line tension was determined by comparing the dihedral angle at the root of a flat and a curved grain boundary groove. A measurement of grain boundary triple line tension was achieved by the investigation of the force equilibrium at a triple junction as established by the inclination of the adjourning grain boundary grooves at the root of the triple junction. The experimental technique utilized atomic force microscopy (AFM) to scan the surface topography of grain boundary thermal grooves and triple junctions.The mean value of the dihedral angle on a flat grain boundary groove in copper polycrystals was 161.8°, with a scatter of 2.3°. Assuming a surface energy of 1.75J/m2, the corresponding grain boundary energy was about 0.6J/m2. The grain boundary energies of a low angle grain boundary (9.4° 118 pp. Englisch. …

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Bibliographic details

Title
Investigation of Triple Line Energy in Copper with Atomic Force Microscopy
Author
Bingbing Zhao
Publisher
Cuvillier Nov 2011
Publication year
2011
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3869559462
ISBN 13
9783869559469
Item weight
164 grams
Dimensions
210x148x6 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

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AbeBooks seller since January 11, 2012

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BuchWeltWeit Ludwig Meier e.K.

Germany