Introduction to Multichip Modules

The first comprehensive text for the hot new multichip module technology

Introduction to Multichip Modules is the first book to provide a comprehensive introduction to the technology of MCM–based electronic packaging—an innovation that has brought tremendous improvements in performance to computing systems of all kinds.

A basic text and a professional reference in one, this book explores areas of relevance in both electrical engineering and computer science. It comes complete with review– and research–oriented problems, an extensive bibliography, and over 100 illustrations.

Useful and instructive in many ways, Introduction to Multichip Modules:

• Discusses the benefits as well as the problems arising from the compact packaging design of MCMs
• Presents technical material in a systematic way, and supplements it with information on industrial developments and applications
• Compares previous electronic packaging with the new technology in its discussion of the evolution of MCMs
• Includes material relevant to diverse industrial segments, such as thermal management groups, CAD groups, electrical simulation, and interconnect analysis groups
• Provides extensive technical information for designers of MCMs and MCM–based systems, while acting as a quick reference for CAD engineers involved in tool design for this technology.

Ideal for university courses, Introduction to Multichip Modules can be used in advanced topics classes or research courses in multichip modules, electronic packaging, or CAD tools for MCMs.

Multichip modules (MCMs) represent the latest in packaging technology for high–performance computing systems. Developed in response to advances in integrated circuit technology, especially VLSI technologies, MCMs′ compact design of bare chips on multichip modules provides superior system performance and reliability, increased operating speed, and reduced system size and weight. At the same time, this design presents its own set of challenges and problems unlike anything in traditional, single–chip–module electronic packaging. These include excess heat, electronic noise, and new electronic phenomena occurring at higher operating frequencies.

Introduction to Multichip Modules is the first book to provide complete coverage of the basics of this new technology for students and professionals alike. It covers all aspects of MCM, including classification, design, and CAD tools, and explains methods and materials used in the design of MCM–based systems. This book also examines the advantages and disadvantages of various types of design; demonstrates methods of improving system reliability; and discusses the advantages of MCMs over traditional packaging methods for electronic–based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time.

An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM–based systems, and for those in computer science who develop CAD tools for MCMs, this book is also useful to anyone who would like to know more about the evolution of this technology and where the new advances in the field may lead us.

NAVEED SHERWANI graduated from the University of Nebraska at Lincoln in 1988, and then joined the Department of Computer Science at Western Michigan University. Naveed′s research concentrates on combinatorics, graph algorithms, and algorithms for VLSI design automation. Dr. Sherwani has published over seventy–five refereed papers in various journals and conferences, and his paper on three–layer over–the–cell routing received the Distinguished Paper Award at ICCAD–91. He is also the author or coauthor of four books. In 1994, Dr. Sherwani joined Intel, where he currently leads the company′s project on full chip layout. His work concentrates on over–the–cell routing for designing chips with very high–frequency goals.

QIONG YU received his MS degree in computer science from Western Michigan University in 1994. His research topics include MCM technology and routing algorithms, and he is the author of three published papers on these topics. During his graduate studies, he received an ACM/SIGDA scholarship, an excellence in research award, and placed on the graduate student honor roll. In 1994, Qiong Yu joined the technical staff of Cadence Design Systems. He is currently involved in the development of CAD tools for advanced packaging technologies for single chip as well as multichip modules.

SANDEEP BADIDA is a 1994 graduate of Western Michigan University, Kalamazoo, where he worked as a research assistant at the VLSI research lab. His work there focused on design and analysis of data structures and algorithms for graph theory and VLSI/MCM physical design automation. Mr. Badida has three publications to his credit in the area of high–performance routing for MCMs. For these papers, and in recognition of his outstanding research potential, he was honored with a 1994 Excellence in Research Award. Currently, Mr. Badida works for Advanced Micro Devices in the CAD Technology and Systems (CTS) group.