Integrated System-Level Modeling of Network-On-Chip Enabled Multi-Processor Platforms

Language: English

Published by Springer Jul 2006, 2006

1402048254 / 9781402048258

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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Neuware - We are presently observing a paradigm change in designing complex SoC as it occurs roughly every twelve years due to the exponentially increasing number of transistors on a chip. This design discontinuity, as all previous ones, is characterized by a move to a higher level of abstraction. This is required to cope with the rapidly increasing design costs. While the present paradigm change shares the move to a higher level of abstraction with all previous ones, there exists also a key difference. For the rst time shrinking geometries do not leadtoacorrespondingincreaseofperformance. InarecenttalkLisaSuofIBM pointed out that in 65nm technology only about 25% of performance increase can be attributed to scaling geometries while the lion share is due to innovative processor architecture [1]. We believe that this fact will revolutionize the entire semiconductor industry. What is the reason for the end of the traditional view of Moore's law It is instructive to look at the major drivers of the semiconductor industry: wireless communications and multimedia. Both areas are characterized by a rapidly increasingdemandofcomputationalpowerinordertoprocessthesophisticated algorithmsnecessarytooptimallyutilizethepreciousresourcebandwidth. The computational power cannot be provided by traditional processor architectures and shared bus type of interconnects. The simple reason for this fact is energy ef ciency: there exist orders of magnitude between the energy ef ciency of an algorithm implemented as a xed functionality computational element and of a software implementation on a processor.…

Seller Inventory # 9781402048258

Title
Integrated System-Level Modeling of Network-On-Chip Enabled Multi-Processor Platforms
Author
Heinrich Meyr
Publisher
Springer Jul 2006
Publication year
2006
Condition
Neu
Binding
Buch
Language
English
ISBN 10
1402048254
ISBN 13
9781402048258
Item weight
539 grams
Dimensions
248x165x14 mm

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