Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales

Luo, Jianfeng; Dornfeld, David A.

ISBN 10: 364206115X ISBN 13: 9783642061158
Published by Springer, 2010
Language: English
Condition: New Soft cover

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