Industry Standard FDSOI Compact Model BSIM-IMG for IC Design
Hu, Chenming (EDT); Khandelwal, Sourabh (EDT); Chauhan, Yogesh Singh (EDT); Mckay, Thomas (EDT); Watts, Josef (EDT)
Language: English
Published by Woodhead Publishing, 2019
Series: Book 119 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
- New
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- Title
- Industry Standard FDSOI Compact Model BSIM-IMG for IC Design
- Author
- Hu, Chenming (EDT); Khandelwal, Sourabh (EDT); Chauhan, Yogesh Singh (EDT); Mckay, Thomas (EDT); Watts, Josef (EDT)
- Publisher
- Woodhead Publishing
- Publication year
- 2019
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 0081024010
- ISBN 13
- 9780081024010
- Series
- Book 119 of 203: Woodhead Publishing Series in Electronic and Optical Materials
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design helps readers develop an understanding of a FDSOI device and its simulation model. It covers the physics and operation of the FDSOI device, explaining not only how FDSOI enables further scaling, but also how it offers unique possibilities in circuits. Following chapters cover the industry standard compact model BSIM-IMG for FDSOI devices. The book addresses core surface-potential calculations and the plethora of real devices and potential effects. Written by the original developers of the industrial standard model, this book is an excellent reference for the new BSIM-IMG compact model for emerging FDSOI technology.
The authors include chapters on step-by-step parameters extraction procedure for BSIM-IMG model and rigorous industry grade tests that the BSIM-IMG model has undergone. There is also a chapter on analog and RF circuit design in FDSOI technology using the BSIM-IMG model.
- Provides a detailed discussion of the BSIM-IMG model and the industry standard simulation model for FDSOI, all presented by the developers of the model
- Explains the complex operation of the FDSOI device and its use of two independent control inputs
- Addresses the parameter extraction challenges for those using this model
"Synopsis" may belong to another edition of this title.
About the Author
Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California Berkeley, United States. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica. He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley’s highest honor for teaching – the Berkeley Distinguished Teaching Award.
Sourabh Khandelwal is an Associate Professor at Macquarie University. He is the lead author of two industry standard compact models: ASM-HEMT for GaN RF and power technology, and ASM-ESD for silicon ESD applications. He has also co-authored BSIM-CMG, BSIM-IMG and BSIM6 compact models during his tenure at the BSIM group at the University of California Berkeley. Dr Khandelwal has published 3 books and over 150 research papers. He regularly serves as consultant to multi-national semiconductor companies.
Yogesh Singh Chauhan is a Chair Professor in the Department of Electrical Engineering at the Indian Institute of Technology Kanpur, India. He is the developer of several industry standard models: ASM-HEMT, BSIM-BULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4 and BSIM-SOI models. His research group is involved in developing compact models for GaN transistors, FinFET, nanosheet/gate-all-around FETs, FDSOI transistors, negative capacitance FETs and 2D FETs. His research interests are RF characterization, modeling, and simulation of semiconductor devices.
Director of RF Innovation at Globalfoundries, USA
Principal Member of Technical Staff at Globalfoundries USA
"About the title" may belong to another edition of this title.
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